Capabilities
Our capabilities encompass high mix, high complexity mission-critical production, including surface mount technologies (SMT), thru-hole, bonding, underfill, and mechanicals. We excel in Design for Manufacturing, Cost & Test (DFX) and provide collaborative manufacturing and test engineering support, including test system design development. Our team is experienced in module-level and backplane circuit card integration, as well as high-level assembly and system integration. We offer microelectronics manufacturing, packaging, and testing services.
Our progressive material management adheres to ASC606 standards, with a supply chain staffed by industry veterans and equipped with best-in-class tools. All production processes comply with IPC Class 3 and J-STD-001 (Space Addendum) standards, and we are certified to Class 0 for ESD. Additionally, we have flip chip capability, vacuum bake-out capability, and high force insertion capabilities.
